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TransthermŽ Gap Fillers are soft materials designed to conduct heat away from uneven surfaces. Improved conformability allows for intimate contact over rough surfaces or multiple component heights.
Features
- Tsoft VO: High conformity to uneven or rough surfaces
- Tsoft 3S: For enhanced thermal performance; supported w/ fiberglass
- Tsoft 3: For enhanced thermal performance applications; tacky surface on both sides
- Gapfiller 5590 silicone free for silicone sensitive applications
- UL 94 V-O flammability rating
- Available in a variety of thicknesses
Applications
- Computer system and telecommunications peripherals
- Power conversion
- To transfer heat from ICs/PCBA/motor to heat sink, chassis or heat spreader
- Automotive electronics
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